Armstrong Fluid Technology has introduced a new integrated digital platform, named Envelope, that connects components in a mechanical system. Envelope unites Armstrong and partner solutions, delivering optimization through performance mapping, cutting-edge analytics and lifecycle services.
A core element of the Envelope platform is the ability to create detailed performance ‘profiles’ of components in a system, and to leverage that knowledge for optimal sizing and modulation of output.
Commenting on the potential for the Envelope Platform, Pratik Sharma, Global Director, Building Services & Performance Management, stated “The true power of the Envelope Platform is in how it enables system optimization through performance coupling with partner products or solutions. Working within this platform, Armstrong, and digitally controlled solutions of all types, can connect and coordinate operations for improved performance and efficiency. Components that can be connected to the Envelope platform include chillers, cooling towers, boilers and heat pumps, made by a wide range of well-known industry manufacturers.”
As demand for high-efficiency, electrified heating solutions grows in North America, Midea continues to lead innovation in heat pump technology and is focusing on making ...
Weil-McLain®, a leader in hydronic comfort heating solutions, introduces the ECO™ HP Air-to-Water Heat Pump, a cutting-edge electric heat pump designed for residential an...
VETO PRO PAC, ® known for creating the premium tool bag category over 20 years ago, is excited to announce the launch of the NORWALK BY VETO product collection, part of o...