Armstrong Launches Envelope(TM) Platform For Continuous Optimization Of Mechanical Systems Delivers Significant Cost And Energy Savings

Armstrong Fluid Technology has introduced a new integrated digital platform, named Envelope, that connects components in a mechanical system. Envelope unites Armstrong and partner solutions, delivering optimization through performance mapping, cutting-edge analytics and lifecycle services.

A core element of the Envelope platform is the ability to create detailed performance ‘profiles’ of components in a system, and to leverage that knowledge for optimal sizing and modulation of output.

Commenting on the potential for the Envelope Platform, Pratik Sharma, Global Director, Building Services & Performance Management, stated “The true power of the Envelope Platform is in how it enables system optimization through performance coupling with partner products or solutions. Working within this platform, Armstrong, and digitally controlled solutions of all types, can connect and coordinate operations for improved performance and efficiency. Components that can be connected to the Envelope platform include chillers, cooling towers, boilers and heat pumps, made by a wide range of well-known industry manufacturers.”