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Armstrong Fluid Technology has announced the availability of six new Design Envelope pump models engineered specifically for low-flow, high-head applications.
With the current emphasis on energy and cost savings in buildings of all types, there is a growing requirement for pumps that serve lower flow ranges. To meet this customer demand, Armstrong has added 3 new Design Envelope Tango models
25-80 (1 x 1 x 3)
32-125 (1.25 x 1.25 x 5)
40-125 (1.5 x 1.5 x 5)
and 3 new Design Envelope Vertical In-Line models
25-80 (1 x 1 x 3)
32-125 (1.25 x 1.25 x 5)
40-125 (1.5 x 1.5 x 5)
Design Envelope industry-leading pumps feature on-board intelligence, connectivity and reporting capabilities. Contractors and maintenance professionals will also appreciate
Commenting on the new Design Envelope pumps, Joachim Schulz, Commercial Director, Global Building Business said, “Design Envelope pumps offer impressive value for customers, and these six new sizes will provide a great solution for low-flow applications. Design Envelope pumps are known for providing the lowest installed cost as well as the lowest lifecycle and operating costs.”
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